SOT-553 package
Molding compound flammability rating: UL 94V-0
Quantity Per Reel : 3,000pcs
Reel Size : 7 inch
Lead Finish : Lead Free
Cellular Handsets and Accessories
Portable Electronics
Industrial Controls
Set-Top Box
Servers, Notebook, and Desktop PC
Rating |
Symbol |
Value |
Units |
Peak Pulse Power (tp =8/20μs) |
PPK |
20 |
Watts |
ESD Voltage (Contact) |
VESD |
±8 |
Kv |
ESD Voltage (Air) |
VESD |
±15 |
Kv |
Lead Soldering Temperature |
TL |
260 (10 sec.) |
°C |
Operating Temperature |
TJ |
-55 to +125 |
°C |
Storage Temperature |
TSTG |
-55 to +150 |
°C |
Type Number |
Reverse Stand-Off Voltage |
Minimum Breakdown Voltage |
Peak Pulse Voltage @8/20μS |
Peak Pulse Current @8/20μS |
Reverse Leakage @VRWM |
Typical |
Capacitance |
||||||
VRWM |
VBR@1mA |
VC@1A |
IPP |
IR@VRWM |
CJ@ 1 MHz |
|
V |
V |
V |
A |
μA |
pF |
|
RLST553A054LV |
5 |
6 |
9.8 |
2 |
1 |
1 |
Profile Feature |
Pb-Free Assembly |
Average ramp-up rate (TL to TP) |
3°C/second max. |
Preheat -Temperature Min (TS min) -Temperature Max (TS max) -Time (min to max) (ts) |
150°C 200°C 60-180 seconds |
TS max to TL -Ramp-up Rate |
3°C/second max. |
Time maintained above: -Temperature (TL) -Time (tL) |
217°C 60-150 seconds |
Peak Temperature (TP) |
260°C |
Time within 5°C of actual Peak Temperature (tP) |
20-40 seconds |
Ramp-down Rate |
6°C/second max. |
Time 25°C to Peak Temperature |
8 minutes max. |
Dimensions |
||||||
DIM |
Inches |
Millimeters |
||||
Min |
Nom |
Max |
Min |
Nom |
Max |
|
A |
0.020 |
0.021 |
0.023 |
0.50 |
0.55 |
0.60 |
b |
0.007 |
0.009 |
0.011 |
0.17 |
0.22 |
0.27 |
C |
0.003 |
0.005 |
0.007 |
0.08 |
0.12 |
0.18 |
D |
0.059 |
0.062 |
0.066 |
1.50 |
1.6 |
1.7 |
E |
0.043 |
0.047 |
0.051 |
1.10 |
1.20 |
1.30 |
e |
0.02 BSC |
0.5BSC |
||||
L |
0.004 |
0.008 |
0.012 |
0.10 |
0.20 |
0.30 |
HE |
0.059 |
0.062 |
0.067 |
1.50 |
1.60 |
1.70 |