Gas Discharge Tubes – SMD4532-400NF-B
SMD4532 Gas Discharge Tube (GDT) series are specifically designed for protection of electrical, multimedia, and communication equipment against over voltage transients in surface mount assembly applications.
Excellent response to fast rising transients
Stable breakdown voltage
GHz working frequency
8/20μs Impulse current capability:5KA
Surface Mount package
Non-Radioactive
Ultra Low capacitance(<1pF) and insertion loss
Lead-free and RoHS compliant
UL 497B Recognized: E465335
Very Small Size(EIA 1812)
Storage and operational temperature: -40~+90°C
Communication equipment
CATV equipment
Test equipment
Data lines
Power supplies
Telecom SLIC protection
Broadband equipment
ADSL equipment,including ADSL2+
XDSL equipment
Satellite and CATV equipment
General telecom equipment
|
DC Spark-over Voltage 1) 2) |
at 100V/S |
370~520 |
V |
|
|
Impulse Spark-over Voltage |
at 100V/μS |
<600 |
V |
|
|
at 1KV/μS |
<650 |
V |
||
|
Service life |
||||
|
Impulse Discharge Current |
8/20μS |
±5 times |
1 |
KA |
|
8/20μS |
1 time |
2 |
KA |
|
|
AC Discharge Current |
50Hz,1S |
5 times |
1 |
A |
|
Impulse Life |
10/1000μS |
±200 times |
10 |
A |
| Impulse Withstanding Voltage Capacity | 10/700μS, 40W | ±5 times | 6 | KV |
|
Insulation Resistance |
at DC 100V |
>1 |
GΩ |
|
|
Capacitance |
at 1MHz |
<1 |
pF |
|
|
Glow Voltage |
at 10mA |
~60 |
V |
|
|
Arc Voltage |
at 1A |
~10 |
V |
|
|
Glow to Arc transition current |
~0.3 |
A |
||
|
Weight |
~0.20 |
g |
||
|
Operation and storage temperature |
-40~90 |
°C |
||
|
Climatic category (IEC60068-1) |
40/090/21 |
|||
|
Marking |
Without |
|||
|
Surface treatment |
Matte-tin plated |
|||
1) At delivery AQL 0.65 level II, DIN ISO 2859
2) In ionized mode
Terms in accordance with ITU-T Rec. K.12, IEC 61643-311, GB/T 9043.
|
Symbol |
Millimeters |
Inches |
|
A |
3.2±0.2 |
0.126±0.008 |
|
B |
2.7±0.2 |
0.106±0.008 |
|
C |
4.5±0.3 |
0.177±0.012 |
|
D |
0.5±0.1 |
0.020±0.004 |
|
X |
1.5 |
0.059 |
|
X1 |
4.5 |
0.177 |
|
Y |
4.2 |
0.165 |
|
Symbol |
Millimeters |
Inches |
|
W |
12±0.3 |
0.472±0.012 |
|
A0 |
3.5±0.1 |
0.138±0.004 |
|
B0 |
5.3±0.1 |
0.209±0.004 |
|
K0 |
2.9±0.1 |
0.114±0.004 |
|
P |
8.0±0.1 |
0.315±0.004 |
|
F |
5.5±0.1 |
0.217±0.004 |
|
E |
1.75±0.1 |
0.069±0.004 |
|
D |
1.5+0.1/-0.0 |
0.059+0.004/-0.0 |
|
P0 |
4±0.1 |
0.157±0.004 |
|
P2 |
2±0.1 |
0.079±0.004 |
|
T |
0.35±0.05 |
0.014±0.002 |
|
D0 |
13.3±0.15 |
0.524±0.006 |
|
D1 |
330±2 |
12.992±0.079 |
|
D2 |
100+1/-2 |
3.937+0.039/-0.079 |
|
W1 |
12.5±0.4 |
0.492±0.016 |
Packaging Quantity:
2,500 PCS per reel (13”)
3 reels per inner box
7,500 PCS per inner box
|
Reflow Condition |
Pb - Free assembly |
|
|
Pre Heat |
-Temperature Min (Ts(min)) |
150°C |
|
-Temperature Max (Ts(max)) |
200°C |
|
|
- Time (min to max) (ts) |
60 -180 Seconds |
|
|
Averageramp up rate ( LiquidsTemp TL) to peak |
3°C/second max |
|
|
TS(max) to TL - Ramp-up Rate |
5°C/second max |
|
|
Reflo w |
- Temperature (TL) (Liquids) |
217°C |
|
- Time (min to max) (ts) |
60 -150 Seconds |
|
|
Peak Temperature (TP) |
260 +0/-5°C |
|
|
Time within 5°C of actual peak Temperature (tp) |
10 - 30 Seconds |
|
|
Ramp-down Rate |
6°C/second max |
|
|
Time 25°C to peak Temperature (TP) |
8 minutes Max |
|
|
Do not exceed |
260°C |
|
Surface mounted components (SMD) may exhibit a temporary increase in the DC spark-over voltage after the solder reflow process. The components will recover within 24 hours. There is no quality defect nor change in protection levels during the temporary change in DC spark-over voltage.
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