Gas Discharge Tubes – SMD4532-400NF-B

Gas Discharge Tubes – SMD4532-400NF-B

Short Description:

Gas discharge tubes (GDT) use noble gasses enclosed in ceramic tubes to provide an alternate circuit path for voltage spikes. The ceramic envelope and with nickel connectors allow for high loads. SMD4532 Gas Discharge Tubes (GDT) series has a surge rating of 1kA, 8/20μs.Offered in a Squared Surface Mount package, which helps to make pick and place on PCB process easier.

This GDT series is perfectly suited for broadband equipment applications. The GDT’s low off-state capacitance is compatible with high bandwidth applications and this capacitance loading value does not vary if the voltage across the GDT changes.


Product Detail

Product Tags

SMD4532 Gas Discharge Tube (GDT) series are specifically designed for protection of electrical, multimedia, and communication equipment against over voltage transients in surface mount assembly applications.

Electrical symbol

Electrical symbol

Features

Excellent response to fast rising transients

Stable breakdown voltage

GHz working frequency

8/20μs Impulse current capability:5KA

Surface Mount package

Non-Radioactive

Ultra Low capacitance(<1pF) and insertion loss

Lead-free and RoHS compliant

UL 497B Recognized: E465335

Very Small Size(EIA 1812)

Storage and operational temperature: -40~+90°C

Applications

Communication equipment

CATV equipment

Test equipment

Data lines

Power supplies

Telecom SLIC protection

Broadband equipment

ADSL equipment,including ADSL2+

XDSL equipment

Satellite and CATV equipment

General telecom equipment

 

Product Name

Product Name

Electrical Characteristics

DC Spark-over Voltage  1) 2)

at 100V/S

370~520

V

Impulse Spark-over Voltage

at 100V/μS

<600

V

at 1KV/μS

<650

V

Service life

Impulse Discharge Current

8/20μS

±5 times

1

KA

8/20μS

1 time

2

KA

AC Discharge Current

50Hz,1S

5 times

1

A

Impulse Life

10/1000μS

±200 times

10

A

Impulse Withstanding Voltage Capacity 10/700μS, 40W  ±5 times  6  KV

Insulation Resistance

at DC 100V

>1

Capacitance

at 1MHz

<1

pF

Glow Voltage

at 10mA

~60

V

Arc Voltage

at 1A

~10

V

Glow to Arc transition current

~0.3

A

Weight

~0.20

g

Operation and storage temperature

-40~90

°C

Climatic category (IEC60068-1)

40/090/21

Marking

Without

Surface treatment

Matte-tin plated

1) At delivery AQL 0.65 level II, DIN ISO 2859

2) In ionized mode

Terms in accordance with ITU-T Rec. K.12, IEC 61643-311, GB/T 9043.

Dimensions

Dimensions

Symbol

Millimeters

Inches

A

3.2±0.2

0.126±0.008

B

2.7±0.2

0.106±0.008

C

4.5±0.3

0.177±0.012

D

0.5±0.1

0.020±0.004

X

1.5

0.059

X1

4.5

0.177

Y

4.2

0.165

Taping and Reel Specifications

Taping and Reel Specifications

Symbol

Millimeters

Inches

W

12±0.3

0.472±0.012

A0

3.5±0.1

0.138±0.004

B0

5.3±0.1

0.209±0.004

K0

2.9±0.1

0.114±0.004

P

8.0±0.1

0.315±0.004

F

5.5±0.1

0.217±0.004

E

1.75±0.1

0.069±0.004

D

1.5+0.1/-0.0

0.059+0.004/-0.0

P0

4±0.1

0.157±0.004

P2

2±0.1

0.079±0.004

T

0.35±0.05

0.014±0.002

D0

13.3±0.15

0.524±0.006

D1

330±2

12.992±0.079

D2

100+1/-2

3.937+0.039/-0.079

W1

12.5±0.4

0.492±0.016

Packaging Quantity:
2,500 PCS per reel (13”)
3 reels per inner box
7,500 PCS per inner box

Soldering Parameters - Reflow Soldering (Surface Mount Devices)

Soldering Parameters - Reflow Soldering (Surface Mount Devices)

Reflow Condition

Pb - Free assembly

Pre

Heat

-Temperature Min (Ts(min))

150°C

-Temperature Max (Ts(max))

200°C

- Time (min to max) (ts)

60 -180 Seconds

Averageramp up rate ( LiquidsTemp TL) to peak

3°C/second max

TS(max) to TL - Ramp-up Rate

5°C/second max

Reflo

w

- Temperature (TL)

(Liquids)

217°C

- Time (min to max) (ts)

60 -150 Seconds

Peak Temperature (TP)

260 +0/-5°C

Time within 5°C of actual peak

Temperature (tp)

10 - 30 Seconds

Ramp-down Rate

6°C/second max

Time 25°C to peak Temperature (TP)

8 minutes Max

Do not exceed

260°C

Surface mounted components (SMD) may exhibit a temporary increase in the DC spark-over voltage after the solder reflow process. The components will recover within 24 hours. There is no quality defect nor change in protection levels during the temporary change in DC spark-over voltage.


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