Single-shot pulse generators
Turbine engine ignition circuits
Medical lithotripsy
High energy switches
All ratings given in this data sheet a reab solute, nonsimultaneous ratings. It is the equipment designer’s responsibility to ensure that they are not exceeded. The spark gap life depends on circuit conditions such as peak discharge current and duration, charge transfer per discharge and the repetition rate.
Charge transfer, single discharge (8/20 ms waveshape) |
0.5C max |
Cumulative charge transfer |
6000C at 0.81mC per discharge at 1 Hz |
Operating temperature |
-55 to +125°C |
Mechanical shock, half-sine (to B.S. 2011 test Ea) |
40g for 4ms |
Mounting |
screw mounted |
Radioactivity |
tritium (3H), 5.44 MBq (147 mCi) max per device |
Type Number |
DC Spark-Over Voltage |
Max. Impulse Discharge Curr nt(8/20μs) |
Max. Energy Level |
Min. Insulation Resistance |
Max. Capacitance |
Max. power |
V |
KA |
J |
MΩ |
pF |
W |
|
GXH05 |
500±10% |
30 |
60 |
100 |
5 |
60 |
GXH10 |
1000±10% |
30 |
60 |
100 |
5 |
60 |
GXH12 |
1200±10% |
30 |
60 |
100 |
5 |
60 |
GXH14 |
1400±10% |
30 |
60 |
100 |
5 |
60 |
GXH15 |
1500±10% |
30 |
60 |
100 |
5 |
60 |
GXH16 |
1600±10% |
30 |
60 |
100 |
5 |
60 |
GXH18 |
1800±10% |
30 |
60 |
100 |
5 |
60 |
GXH19 |
1900±10% |
30 |
60 |
100 |
5 |
60 |
GXH20 |
2000±10% |
30 |
60 |
100 |
5 |
60 |
GXH21 |
2100±10% |
30 |
60 |
100 |
5 |
60 |
GXH22 |
2200±10% |
30 |
60 |
100 |
5 |
60 |
GXH23 |
2300±10% |
30 |
60 |
100 |
5 |
60 |
GXH24 |
2400±10% |
30 |
60 |
100 |
5 |
60 |
GXH25 |
2500±10% |
30 |
60 |
100 |
5 |
60 |
GXH26 |
2600±10% |
30 |
60 |
100 |
5 |
60 |
GXH27 |
2700±10% |
30 |
60 |
100 |
5 |
60 |
GXH28 |
2800±10% |
30 |
60 |
100 |
5 |
60 |
GXH29 |
2900±10% |
30 |
60 |
100 |
5 |
60 |
GXH30 |
3000±10% |
30 |
60 |
100 |
5 |
60 |
GXH31 |
3100±10% |
30 |
60 |
100 |
5 |
60 |
GXH32 |
3200±10% |
30 |
60 |
100 |
5 |
60 |
GXH33 |
3300±10% |
30 |
60 |
100 |
5 |
60 |
GXH34 |
3400±10% |
30 |
60 |
100 |
5 |
60 |
GXH35 |
3500±10% |
30 |
60 |
100 |
5 |
60 |
GXH40 |
4000±10% |
30 |
60 |
100 |
5 |
60 |
GXH45 |
4500±10% |
30 |
60 |
100 |
5 |
60 |
GXH50 |
5000±10% |
30 |
60 |
100 |
5 |
60 |
Hand Soldering
Solder iron temperature: 350 ± 5 °C
Heating time: 3 seconds max
General attention to soldering
1. High soldering temperatures and long soldering times can causeleaching of the termination, decrease in adherence strength, andthe change of characteristic may occur.
2. For soldering , please refer to the soldering curves aboveHowever , please keep exposures to temperatures exceeding 200 Cto fewer than 50 seconds.
3. Please use a mild flux ( containing less than 0. 2wt % CI ). Also , ifthe flux is water soluble, be sure to wash thoroughly to remove anyresidue from the underside of components that could affectresistance.
1 ) Time shown in the above figures is measured from the point when chip surface reaches temperature.
2 ) Temperature difference in high temperature part should be within 110°C
3 ) After soldering , do not force cool , allow the parts to cool gradually.
When using ultrasonic cleaning , the board may resonate if the output power is too high . Since this vibration can cause cracking or a decreasein the adherence of the termination, we recommend that you use the conditions below.
Frequency: 40KHZ max.
Output power: 20W/liter
Cleaning time: 5 minutes max.
DIM |
Millimeters |
Inches |
A |
28±3.0 |
1.102±0.118 |
B |
6.7±1.0 |
0.264±0.039 |
C |
0.5±0.05 |
0.02±0.002 |
D |
Φ2.6±0.5 |
0.102±0.02 |
Symbol |
Millimeters |
Inches |
W |
52.5±1.5 |
2.067±0.059 |
P |
5.0±0.5 |
0.197±0.02 |
L1-L2 |
0.8 max |
0.031max |
T |
6.0±1.0 |
0.236±0.039 |
Z |
1.2max |
0.047max |
t |
3.2max |
0.126max |
S |
0.8max |
0.031max |
A |
75.0 |
2.953 |
B |
68.0 |
2.677 |
C |
255.0 |
10.039 |
Quantity:2000PCS / inner box |